Announcement of "Next generation telecom issues × Material project" Briefing Session

2025.07.25

Japan's telecommunications technology has developed through the horizontal division of labor and competition. Among these, electronic components are one of Japan's strengths, boasting a global market share of more than 30%, but competition from overseas has intensified in recent years. In order to continue to promote Japanese electronic components to the world, we believe it is important to have a problem-solving process that straddles the supply chain.
This time, we have established a project led by the only "materials/manufacturing" member within XGMF.
We hope to use this project as a hub to promote discussion across the supply chain through collaboration within and outside of XGMF.
We would like to reflect your opinions in the management of the project, so please participate actively in this briefing session.

  1. Date: Monday, August 18, 2025, 10:00 - 11:00
  2. Method: Zoom online
    Please register below (Zoom webinar)
    https://us06web.zoom.us/webinar/register/WN_I0tN1uIBQKaQtRjDVHpamA
  3. Agenda:
10:00-10:10
Greetings
Leader: Kenichi Mimura, National Institute of Advanced Industrial Science and Technology (AIST)
Leader Mr. Ryosuke Takada, Nippon Shokubai Co.
Sub Leader Naomi Kamada, ON BOARD Co.
10:10-10:50
Project Explanation & Discussion
10:50-11:00
business communication

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Launch of the "Next Generation Communication Challenges x Materials/Materials Project
Next generation telecom issues × Material project

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